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Military & Aerospace Electronics June 2006 Gurnett & Adams	Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications.
IEEE Spectrum January 2012 Rachel Courtland	3-D Chips Grow Up In 2012, 3-D chips will help extend Moore's Law - and move beyond it.
IEEE Spectrum March 2013 Joachim N. Burghartz	Make Way for Flexible Silicon Chips We need them because thin, pliable organic semiconductors are too slow to serve in tomorrow's chips. Seamless integration of computing into everyday objects isn't quite here yet.
Military & Aerospace Electronics April 2007 Gurnett & Adams	Merging the Functionalities of Silicon, and III-Vs: Two Promising Approaches One of the least flexible rules in electronic design is the need to keep silicon devices, and compound semiconductor devices separate. Two new developments are now threatening to make this rule partly or entirely obsolete.
Military & Aerospace Electronics February 2010 Chris Sanders	3D IC Integration is Poised to Drive the Next Generation of Military Imaging Sensors As military and aerospace design engineers develop imaging systems for the wired battlefield of tomorrow, they face the challenge of providing high-resolution imaging arrays that are light, small, and cheap.
IEEE Spectrum March 2011 Apte et al.	Advanced Chip Packaging Satisfies Smartphone Needs Clever chip packaging means mobile devices can be smaller and smarter
Military & Aerospace Electronics April 2006 Gurnett & Adams	A Military and Aerospace Future for Board-Embedded Chips? There are as yet no distinctly military or aerospace applications for embedded chips, but the advantages that these structures provide are so compelling that their use in military applications seems inevitable within a few years.
IEEE Spectrum February 2005 Singh & Thakur	Chip Making's Singular Future Beleaguered chip makers are counting on single-wafer manufacturing, which makes ICs on one wafer at a time, to cut costs and get chips to market faster.
Military & Aerospace Electronics March 2005 Tom Adams	The shrinking-package approach to low-cost, robust sensor arrays One potential benefit of shrinking the sizes of microelectronics components is the potential to scatter a large number of sensors arranged as a distributed array over an area for surveillance.
IEEE Spectrum January 2008 Sarah Adee	Winner: The Ultimate Dielectric Is...Nothing IBM packs wires in vacuum to speed chips and save power.
InternetNews April 12, 2007 Andy Patrizio	IBM Cures CPU Sprawl With 3D Stacking Instead of spreading out the circuits, IBM researchers say they've found a way to stack them up.
Military & Aerospace Electronics June 2005 John McHale	Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips.
The Motley Fool October 30, 2006 Jack Uldrich	IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency.
Military & Aerospace Electronics August 2006 John McHale	Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating.
Military & Aerospace Electronics May 2006 J.R. Wilson	The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage.
IEEE Spectrum September 2010 Schow et al.	Get on the Optical Bus IBM's light-powered links overcome the greatest speed bump in supercomputing: interconnect bandwidth
Military & Aerospace Electronics May 2009 J.R. Wilson	Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches.
BusinessWeek October 4, 2004 Stephen H. Wildstrom	Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers.
Military & Aerospace Electronics October 2009 Adams & Gurnett	The Coming CMOS Imaging Revolution CMOS image sensors (common in video and digital cameras) are undergoing a qualitative change that will provide a stunning range of new products for consumers, as well as for military and aerospace users.
IEEE Spectrum February 2009 Sally Adee	Solid-State Circuits, in 3-D! At this year's IEEE ISSCC, some 3-D integration technologies are ready to wear, while others will remain haute couture
The Motley Fool September 19, 2006 Jack Uldrich	Intel's New Laser-Like Focus The company's latest silicon chip development could open up exciting new markets. The news offers investors yet another reason to believe Intel remains a sound long-term investment.
InternetNews June 12, 2009 Andy Patrizio	Gartner: Cloud, New Chip Tech May Spur Rebound What will cloud computing and 3D chip manufacturing do for the industry? Quite a bit.
The Motley Fool December 2, 2010 Carl Bagh	IBM Unveils New Chip; Heats Up Supercomputer Battle IBM raises the bar again.
IEEE Spectrum January 2009 Willie D. Jones	Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip
InternetNews March 26, 2007 Andy Patrizio	IBM Gives Networking A 16x Boost IBM researchers have come up with an optical networking chip measuring 3mm by 5mm but has 16 times the throughput of today's networking chips.
IEEE Spectrum December 2007 Joshua J. Romero	Carbon Nanotubes Take the Heat Off Chips Purdue scientists find flexible filaments best.
Military & Aerospace Electronics May 2008 Michael R. Palis	Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers.
Military & Aerospace Electronics July 2005 John Keller	Is cooling the central design issue of our time? The pace of improvements in integrated circuitry is outstripping our ability to remove unwanted heat. And engineers are starting to quip about some of the dilemmas that new cooling approaches may create.
IEEE Spectrum December 2010 Joseph Calamia	Can Carbon Put Copper Down for the Count? In the nano realm, copper vertical interconnects won't cut it
IEEE Spectrum October 2006 Brian R. Santo	Acronym Addiction When you live on the cutting edge of technology, there are, literally, no words to describe it. Instead we have acronyms. Lots and lots of acronyms. ABT... BEOL... CSP... etc.
BusinessWeek June 7, 2004 Otis Port	Fired Up for the Supercomputer Derby The Pentagon's Defense Advance Research Projects Agency contest to spur supercomputers to even more unthinkable speeds is down to three heavyweight contenders.
IEEE Spectrum March 2007 Mouli & Carriker	Future Fab If a billion transistors on a postage-stamp-size chip impress you, consider the fabrication facilities that put them there. How software is helping Intel go nano -- and beyond.
BusinessWeek April 18, 2005 Adam Aston	The Coming Chip Revolution Facing the limits of silicon, scientists are turning to carbon nanotubes. But even with a reliable supply of tubes, scaling up production to supply a vast global industry will take years.
The Motley Fool January 27, 2006 Jack Uldrich	Intel: Smaller Is Better A new 45-nanometer chip could give Intel a big technical advantage. The news won't immediately stem Intel's market-share losses or ignite a rally in its stock price, but it will certainly keep the heat on AMD.
IEEE Spectrum January 2008 Neil Savage	Phase-Change Materials Could Boost Reconfigurable Chips More powerful FPGAs and other reconfigurable chips could come from vertical wires made from phase-change material.
BusinessWeek February 14, 2005 Steve Hamm	IBM Discovers the Power of One Its focus on a single chip line makes it a contender in almost every market.
InternetNews November 27, 2007	Toshiba, NEC Team on 32nm Chips Chip makers Toshiba and NEC Electronics said on Tuesday they would jointly develop 32-nanometer chips to better keep up with rivals.
Military & Aerospace Electronics September 2005	Column on heat issues misses the most fundamental solution Reader says recent editorial on the problem of chip heat was spot on, but missed the most fundamental solution to the problem: don't create the heat in the first place!
The Motley Fool January 29, 2007 Jack Uldrich	IBM and Intel Install a New Gatekeeper Changes to transistor components will keep Moore's Law running smoothly. Which companies stand to come out on top? Investors, take note.
BusinessWeek June 6, 2005 Otis Port	Mighty Morphing Power Processors IBM and others are racing to create chameleon chips that change to suit the job.
The Motley Fool August 30, 2004 Rich Duprey	Profiting From Moore's Law Intel develops a new chip that roughly doubles the number of transistors on a chip. Whether it's in the chip makers themselves, or in the picks and shovels of the industry, investors stand to make big profits from tiny chips.
The Motley Fool May 3, 2007 Jack Uldrich	IBM Minds the Airgap Customers should enjoy the tech firm's latest nanotechnology advance. Investors, take note.
PC Magazine April 1, 2009 John C. Dvorak	Chip Biz Buzzwords It's no surprise that everyone in the Valley is so comfortable with insider and exclusionary code words, many of which make no sense.
IEEE Spectrum December 2009 Neil Savage	New Schemes for Powering Processors Building an on-chip high-voltage transmission grid is one way researchers think they could distribute power better
IEEE Spectrum May 2008 Sally Adee	The Hunt for the Kill Switch Are chip makers building electronic trapdoors in key military hardware? The Pentagon is making its biggest effort yet to find out
IEEE Spectrum May 2009 Guizzo & Santo	The Runners-up: More Earthshaking Chips These 13 great little chips didn't make our list -- mainly because we ran out of space in print. And, well, one isn't even a chip
Wall Street & Technology January 22, 2008 Larry Tabb	Data Center Engineering Needs To Consider Consumption The modern data center must be crafted with regard to resource consumption so financial firms can obtain enough power to analyze data, manage the markets and route orders.
The Motley Fool July 18, 2006 Dan Bloom	ARM Plugs Chips' Leaks ARM and Taiwan Semi team up to produce a low-power chip.
PC World September 12, 2002 James Niccolai	Tomorrow's CPU: Wireless Link Inside Intel finds new ways to shrink, speed chips, plus build in radio functions.
PC World December 3, 2001 Martyn Williams	AMD Announces Another Chip Advance Company's new transistor is five times smaller than current models, leading to faster and more complex chips...