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Military & Aerospace Electronics
May 2007
John Keller
Through with Hydraulics? Think Again Opportunity for leaks, outright breaks, clogs, and the weight of liquid and pipe have led aircraft designers to search for a way to eliminate hydraulic systems. Electric systems looked promising, but now it's back to the drawing board. mark for My Articles similar articles
Military & Aerospace Electronics
May 2007
John Keller
Temperature's Rising: Designers Face Myriad Options to Cool Electronic Systems More electronic and electro-optic systems mean more electric power, and increasing heat that engineers must get rid of. Today's choices include convection, conduction, and liquid-cooling options. Tomorrow's choices will be more complex. mark for My Articles similar articles
Military & Aerospace Electronics
May 2006
J.R. Wilson
The great cooling dilemma: conduction, convection, or liquid Today's most advanced cooling technologies are starting to take center stage. mark for My Articles similar articles
Military & Aerospace Electronics
May 2009
J.R. Wilson
Electronic thermal management is heading to the wall Systems designers who are used to boosting electronic system performance by adding ever-more transistors may have to rethink their design approaches. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Michael R. Palis
Advances in thermal management techniques for chassis design A new approach to thermal management involves separating the ambient environment and the operating electronics to keep out contaminants. A convenient way to do this is using compact air-to-air heat exchangers. mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Courtney E. Howard
Hot components and cool enclosures Systems architects and integrators are tackling the issues of military electronics survivability with clever chassis designs. mark for My Articles similar articles
Military & Aerospace Electronics
December 2006
John Keller
Demands for High Power and Optimum Size Drive Some Power-Supply Makers Away From Traditional COTS Solutions Moore's Law is placing a set of increasingly crushing demands on power-component makers who must feed the right amounts of electricity to the latest generations of microprocessor behemoths. mark for My Articles similar articles
The Motley Fool
October 30, 2006
Jack Uldrich
IBM to Chips: Cool It! Big Blue's new chip-cooling technique could keep Moore's Law on track. IBM's system, while not yet ready for commercial production, is reportedly so efficient that officials expect it will double cooling efficiency. mark for My Articles similar articles
Military & Aerospace Electronics
July 2009
Parker Offers Liquid Cooling for High-Power Electronic Thermal Management Parker Hannifin is introducing a two-phase liquid cooling system for electronic thermal management and heat removal from high-power electronics. mark for My Articles similar articles
BusinessWeek
October 4, 2004
Stephen H. Wildstrom
Those Superfast Chips: Too Darn Hot Cooling today's fastest chips is becoming a challenge in even the biggest desktop towers. mark for My Articles similar articles
Military & Aerospace Electronics
August 2006
John McHale
Purdue Researchers Look at Nanotechnology to Reduce Computer-Chip Heating University researchers are looking to mitigate electronic systems heating problems through the use of carbon nanotubes. They have created carpets of microscopic nanotubes to enhance the performance of heat sinks to help keep future chips from overheating. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management a Challenge for Designers of Future Military Aircraft Today's aviation, vetronics, and other military-aero applications require more power, but have less space. This contributes to higher thermal loads and less opportunity to drive the heat out. mark for My Articles similar articles
Military & Aerospace Electronics
December 2007
John Keller
Cost-Sensitive Military Pressures Power Supply Makers to Shrink and Ruggedize COTS Devices Manufacturers of power electronics for military and aerospace applications say they are under pressure to shrink device size and keep a lid on prices, as well as to ruggedize and integrate off-the-shelf components. mark for My Articles similar articles
IEEE Spectrum
January 2009
Willie D. Jones
Intel-led Team Demonstrates First Chip-Scale Thermoelectric Refrigerator An integrated thermoelectric device cools a hot spot on a much larger chip mark for My Articles similar articles
Military & Aerospace Electronics
February 2007
John McHale
Thermal-management challenges highlight Military Technologies Conference 2007 U.S. Department of Defense and industry experts to discuss thermal and power management at the Military Technologies Conference (March 27 and 28, 2007) in Boston. mark for My Articles similar articles
Military & Aerospace Electronics
April 2009
Courtney E. Howard
Thinking Inside the Box Systems engineers and technology firms partner to equip mil-aero platforms with innovative enclosures, backplanes, and electronics packaging. mark for My Articles similar articles
Military & Aerospace Electronics
November 2007
John McHale
Purdue Researchers Demonstrate New Chip-Cooling Technology Researchers are taking a new approach with a new technology that uses tiny ionic wind engines that they say might dramatically improve computer chip cooling-a constant challenge for military and commercial electronics designers. mark for My Articles similar articles
Military & Aerospace Electronics
June 2005
John McHale
Purdue Researchers Create Miniature Cooling Device Mechanical engineers have developed techniques for modifying household refrigeration technology with small devices to cool future weapons systems and computer chips. mark for My Articles similar articles
Military & Aerospace Electronics
February 2010
John Keller
Intel i7 microprocessor set to produce tectonic shift in industry The military embedded computer industry has been turning backflips since last month amidst the excitement surrounding the 7 Jan. introduction by microprocessor giant Intel Corp. of the latest versions of its Core i7, i5, and i3 processors at the International Consumer Electronics Show. mark for My Articles similar articles
Military & Aerospace Electronics
February 2008
Nextreme Offers Electro-Optics and Microelectronics Cooler for Military Applications Nextreme Thermal Solutions is introducing the Ultra-High Packing Fraction (UPF) OptoCooler thermoelectric module for cooling and temperature-control requirements for electronics, medical, military, and aerospace applications. mark for My Articles similar articles
IndustryWeek
February 1, 2004
John Teresko
Helping Electronics Keep Their Cool New thermal-management technology doesn't need cooling fans, say Georgia Tech researchers. mark for My Articles similar articles
Military & Aerospace Electronics
April 2008
Courtney E. Howard
Thermal Management Targets the Enemy of Electronics: Excessive Heat Heat threatens the longevity and performance of electronics, especially vehicular electronics (vetronics), in military-aero environments. mark for My Articles similar articles
IEEE Spectrum
June 2011
Eliza Strickland
Thermoelectrics Get Cooler Start-ups are advancing solid-state cooling systems mark for My Articles similar articles
Military & Aerospace Electronics
March 2009
Keith Gurnett & Tom Adams
Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances. mark for My Articles similar articles
Military & Aerospace Electronics
February 2006
John Keller
Time for a new embedded packaging standard Military technology specifiers and their suppliers in the aerospace and defense industries should come up with a new electronics packaging standard to complement -- and sometimes replace -- the venerable air transport rack described in ARINC 404A. mark for My Articles similar articles
Military & Aerospace Electronics
September 2008
Bogdanski & Lamparter
Component and Design Considerations for Extended Product Lifecycles Choosing the right component supplier can be as important as choosing the right component, especially when long-term planning and upgrades are considered, or when special features are required. mark for My Articles similar articles
IEEE Spectrum
March 2011
Apte et al.
Advanced Chip Packaging Satisfies Smartphone Needs Clever chip packaging means mobile devices can be smaller and smarter mark for My Articles similar articles
Military & Aerospace Electronics
May 2008
Vette Corp. Offers Liquid Cooling for High-Power Electronics Components Electronics cooling specialist Vette Corp. is offering Aluma-Cop liquid cooling for insulated gate bipolar transistors (IGBTs). mark for My Articles similar articles
Military & Aerospace Electronics
April 2010
Avionics Computers for Navy Combat Jets Come From General Dynamics in $30.6 Million Contract Avionics computer systems designers will provide the U.S. Navy with 118 Type 3 advanced mission computers for carrier-based F/A-18 and E/A-18G jet fighter-bomber and electronic warfare aircraft mark for My Articles similar articles
InternetNews
August 15, 2007
Andy Patrizio
A Mighty Wind's a Blowin' at Purdue Researchers at Purdue University have developed a new method of semiconductor cooling that could improve the cooling rate inside computers by as much as 250 percent. mark for My Articles similar articles
Military & Aerospace Electronics
January 2006
Ben Ames
Rugged Computers Power the Digital Battlefield Troops are pushing rugged computers harder than ever, as manufacturers seek tougher display screens, more reliable hard drives, and faster processors. A major challenge for engineers is to keep pace with fast upgrades in COTS technology. mark for My Articles similar articles
Military & Aerospace Electronics
September 2005
Ram Rajan
Solving thermal-management challenges in military and aerospace applications Higher system performance -- often coupled with faster and hotter processors, and denser packaging -- can be two major nemeses for the chassis designer. mark for My Articles similar articles
Technology Research News
August 27, 2003
Metal process makes heat chips Researchers from the California Institute of Technology have found a way to make tiny thermoelectric devices that can be used to generate electrical power from heat and to cool very small areas. mark for My Articles similar articles
Military & Aerospace Electronics
March 2006
Ben Ames
Engineers Balance Speed and Heat in a Single Board Processors and switched-fabric networks are moving data at faster speeds then ever before, which is leading designers to come up with innovative approaches to channeling information flow, power management, and keeping boards cool. mark for My Articles similar articles
InternetNews
April 15, 2005
Michael Singer
Moore's Law Relevant But Not Forever The debate continues as the 40th anniversary of Moore's article approaches. mark for My Articles similar articles
Military & Aerospace Electronics
December 2005
John McHale
ISR to Develop System for Thermal Management on Aging Military Aircraft Engineers at ISR, are developing next-generation common thermal-management systems for the U.S. Air Force current and future aircraft. mark for My Articles similar articles
Military & Aerospace Electronics
May 2009
CSPI selects SprayCool cooling for deployments in harsh environments Engineers at CSP Inc.'s MultiComputer Division, a supplier of rugged embedded clusters in San Diego, needed a thermal management system for their company's FastCluster product line. mark for My Articles similar articles
The Motley Fool
August 30, 2004
Rich Duprey
Profiting From Moore's Law Intel develops a new chip that roughly doubles the number of transistors on a chip. Whether it's in the chip makers themselves, or in the picks and shovels of the industry, investors stand to make big profits from tiny chips. mark for My Articles similar articles
Military & Aerospace Electronics
March 2010
Courtney E. Howard
Empowering embedded computing Mainstream, COTS technologies combine with aerospace and defense industry innovations to deliver increased performance in compact electronics designs mark for My Articles similar articles
BusinessWeek
October 4, 2004
Cliff Edwards
Intel: Supercharging Silicon Valley Intel's founding trio fashioned the building block for the digital revolution mark for My Articles similar articles
IEEE Spectrum
November 2008
Monica Heger
IBM Tests Heating Homes With Data-Center Waste Heat Cooling computers with hot water is a step toward zero-emission data centers mark for My Articles similar articles
Military & Aerospace Electronics
February 2005
Ben Ames
Next-generation airborne radar demands powerful computers The radar on the Air Force Global Hawk UAV will track cars and missiles with a powerful onboard computer from Mercury Computer Systems. mark for My Articles similar articles
Military & Aerospace Electronics
August 2009
SprayCool Offers 3U Rackmount Chassis with Liquid Cooling for Avionics and Vetronics The 3U rugged enclosure is designed for armored vehicle vetronics, and aircraft avionics that require small, lightweight, low-power, and low-cost military embedded aerospace electronics. mark for My Articles similar articles
Military & Aerospace Electronics
July 2007
Ben Kuster
CFD Analysis Delivers Impressive Savings for Electronics Thermal Design Computational-fluid-dynamics software is an invaluable thermal-analysis weapon for the electronics design arsenal. At VT Miltope Corp., it saves weeks of development time and thousands of development dollars-even on small projects. mark for My Articles similar articles
CIO
March 1, 2003
Christopher Lindquist
Low-Heat Laptops You won't be able to use your laptop as a portable coffee warmer anymore, if technology from Sandia National Laboratories goes mainstream. mark for My Articles similar articles
Military & Aerospace Electronics
July 2005
Ben Ames
Power electronics drive next-generation vehicles From electric-drive ships to hybrid Humvees, military vehicles that rely on electric motors will soon rely on advanced power electronics to handle huge voltages in their drive trains. Designers of military vehicles, in fact, see electric power as the next great frontier. mark for My Articles similar articles
Military & Aerospace Electronics
September 2005
Ben Ames
Contractors balance speed and efficiency in digital signal processing Designers of DSP technology for the military are forced to weight the importance of size, weight, speed, power, and cost. mark for My Articles similar articles
IEEE Spectrum
May 2011
Keane & Kim
Transistor Aging Measuring the degradation of microprocessors is tricky. Doing it better would unleash more processing power. mark for My Articles similar articles
The Motley Fool
May 2, 2005
Jack Uldrich
Intel's "Intel Around Us" Strategy Intel's push into the realm of all things nano stretches beyond "Intel Inside" and broadens the company's long-term potential. Investors, take note. mark for My Articles similar articles
Military & Aerospace Electronics
March 2008
John McHale
Managing Thermal Efficiency of Modern Processors Discussed at Military & Aerospace Electronics Forum Current and future-generation processors are creating escalating thermal demands on military designers. mark for My Articles similar articles