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IEEE Spectrum November 2011 Ahmed & Schuegraf	Transistor Wars Rival architectures face off in a bid to keep Moore's Law alive. In May, Intel announced the most dramatic change to the architecture of the transistor since the device was invented.
IEEE Spectrum February 2005 Singh & Thakur	Chip Making's Singular Future Beleaguered chip makers are counting on single-wafer manufacturing, which makes ICs on one wafer at a time, to cut costs and get chips to market faster.
IEEE Spectrum January 2013 Rachel Courtland	Foundries Rush 3-D Transistors Nearly two years after Intel, the world's leading foundries scramble to get FinFETs into the hands of chip designers
IEEE Spectrum January 2007 Samuel K. Moore	Masters of Memory Swiss firm Innovative Silicon crams 5 megabytes of RAM into the space of one. Their chip is called called Z-RAM, and if it grabs even a little piece of the on-chip memory market, it will change the ground rules for microprocessor design and will quickly become a company to be reckoned with.
Military & Aerospace Electronics March 2009 Keith Gurnett & Tom Adams	Up next: through-silicon vias The excitement over TSVs has been caused by the enhancement in process speed that can be gained by shortening distances.
IEEE Spectrum October 2007 Bohr et al.	The High-k Solution Microprocessors coming out this fall are the result of the first big redesign in CMOS transistors since the late 1960s.
IEEE Spectrum March 2011 Apte et al.	Advanced Chip Packaging Satisfies Smartphone Needs Clever chip packaging means mobile devices can be smaller and smarter
IEEE Spectrum November 2007 Sarah Adee	Transistors Go Vertical The semiconductor industry fights silicon sprawl by building up, not out. Today's CMOS transistor is planar, but chip makers are exploring more power-efficient three-dimensional structures as well as a planar structure with two gates.
Chemistry World February 5, 2007 Lionel Milgrom	Hafnium Oxide Helps Make Chips Smaller and Faster Intel and IBM have announced that they will use dramatically different materials to build smaller, faster transistors for their next generation of chips.
Military & Aerospace Electronics June 2006 Gurnett & Adams	Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications.
IEEE Spectrum February 2009 Sally Adee	Solid-State Circuits, in 3-D! At this year's IEEE ISSCC, some 3-D integration technologies are ready to wear, while others will remain haute couture
IEEE Spectrum January 2012 Rachel Courtland	Start-up Seeks New Life for Planar Transistors SuVolta is pursuing precision doping in its bid to compete with 3-D transistor technology
IEEE Spectrum July 2012 Miguel Miranda	The Threat of Semiconductor Variability As transistors shrink, the problem of chip variability grows
IEEE Spectrum March 2013 Joachim N. Burghartz	Make Way for Flexible Silicon Chips We need them because thin, pliable organic semiconductors are too slow to serve in tomorrow's chips. Seamless integration of computing into everyday objects isn't quite here yet.
IEEE Spectrum January 2008 Sarah Adee	Winner: The Ultimate Dielectric Is...Nothing IBM packs wires in vacuum to speed chips and save power.
IEEE Spectrum April 2009 Bill Arnold	Shrinking Possibilities Lithography will need multiple strategies to keep up with the evolution of memory and logic
The Motley Fool January 29, 2007 Jack Uldrich	IBM and Intel Install a New Gatekeeper Changes to transistor components will keep Moore's Law running smoothly. Which companies stand to come out on top? Investors, take note.
InternetNews August 30, 2004 Michael Singer	Intel Evolves Chipmaking Technology The company reaches a tipping point with its 90-nanometer chips, as it works to slim down to 65nm next year.
IEEE Spectrum November 2007 Samuel K. Moore	Intel 45-Nanometer Penryn Processors Arrive Penryn chips are the result of the first fundamental redesign of the CMOS transistor
IEEE Spectrum May 2011 Keane & Kim	Transistor Aging Measuring the degradation of microprocessors is tricky. Doing it better would unleash more processing power.
IEEE Spectrum April 2012 Rachel Courtland	Six Paths to Longer Battery Life These six technologies could save on smartphone power
IEEE Spectrum March 2007 Mouli & Carriker	Future Fab If a billion transistors on a postage-stamp-size chip impress you, consider the fabrication facilities that put them there. How software is helping Intel go nano -- and beyond.
IEEE Spectrum December 2007 Joshua J Romero	Japanese Engineers Turn High-k Dielectric Transistor Problem on Its Head One gate metal and two high-k dielectrics could mean a cheaper and easier 45-nanometer CMOS manufacturing process for transistors.
BusinessWeek April 18, 2005 Adam Aston	The Coming Chip Revolution Facing the limits of silicon, scientists are turning to carbon nanotubes. But even with a reliable supply of tubes, scaling up production to supply a vast global industry will take years.
The Motley Fool August 30, 2004 Rich Duprey	Profiting From Moore's Law Intel develops a new chip that roughly doubles the number of transistors on a chip. Whether it's in the chip makers themselves, or in the picks and shovels of the industry, investors stand to make big profits from tiny chips.
IEEE Spectrum January 2013 Katherine Bourzac	Intel Inside...Your Smartphone With Silvermont, the chip giant may finally get a grip on the mobile market
IEEE Spectrum July 2010 Neil Savage	Hynix Makes No-Capacitor DRAM Z-RAM memory design might find a spot in the competitive DRAM market
PC World March 12, 2002 James Niccolai	Intel Shrinks Chip, Hits Milestone Prototypes of high-density chips support nearly eight times as many transistors as today's Pentium 4...
InternetNews January 27, 2007 Andy Patrizio	Intel Breakthrough Keeps Moore's Law on Track Intel dispenses with silicon for the first time in 40 years in its effort to make smaller, faster and less power-hungry chips.
InternetNews June 12, 2009 Andy Patrizio	Gartner: Cloud, New Chip Tech May Spur Rebound What will cloud computing and 3D chip manufacturing do for the industry? Quite a bit.
IEEE Spectrum October 2006 Brian R. Santo	Acronym Addiction When you live on the cutting edge of technology, there are, literally, no words to describe it. Instead we have acronyms. Lots and lots of acronyms. ABT... BEOL... CSP... etc.
The Motley Fool August 17, 2010 Michael Kanellos	Why Solar Is, and Isn't, Like the Chip Industry Will there be an Intel of solar? Or a lot of Packard-Bells?
IEEE Spectrum October 2008 Monica Heger	Flurry of Floating-Body Memory Research, but Still No Products Intel and Toshiba show off their competitors to Innovative Silicon's Z-RAM
IEEE Spectrum September 2008 Peide D. Ye	Beyond Silicon's Elemental Logic In the quest for speed, key parts of micro-processors may soon be made of gallium arsenide or other III-V semiconductors
IEEE Spectrum June 2006 Rao R. Tummala	Moore's Law Meets Its Match By 2010, the "More Than Moore's Law" movement -- which focuses on system integration rather than transistor density -- will lead to revolutionary megafunction electronics.
PC World December 3, 2001 Martyn Williams	AMD Announces Another Chip Advance Company's new transistor is five times smaller than current models, leading to faster and more complex chips...
IEEE Spectrum December 2008 Sally Adee	The Fastest, the Smallest, and the Strangest at IEDM This year's IEEE International Electron Devices Meeting, as usual, is largely a race to the bottom
IEEE Spectrum April 2012 Liu et al.	MEMS Switches for Low-Power Logic A modern twist on a trusted old technology -- the electromechanical relay -- could lead to ultralow-power chips
The Motley Fool May 10, 2011 Arunava De	New Chip on Intel's Shoulder Could Mean Big Things for Investors Innovative new chip design could ensure Intel the lion's share of the market for chips.
Military & Aerospace Electronics April 2007 Gurnett & Adams	Merging the Functionalities of Silicon, and III-Vs: Two Promising Approaches One of the least flexible rules in electronic design is the need to keep silicon devices, and compound semiconductor devices separate. Two new developments are now threatening to make this rule partly or entirely obsolete.
Military & Aerospace Electronics April 2006 Gurnett & Adams	A Military and Aerospace Future for Board-Embedded Chips? There are as yet no distinctly military or aerospace applications for embedded chips, but the advantages that these structures provide are so compelling that their use in military applications seems inevitable within a few years.
IEEE Spectrum May 2008 Sally Adee	The Hunt for the Kill Switch Are chip makers building electronic trapdoors in key military hardware? The Pentagon is making its biggest effort yet to find out
IEEE Spectrum August 2007 Samuel K. Moore	Z-RAM to Take on DRAM with Hynix Deal The Swiss memory company Innovative Silicon says it has struck a deal to license its technology to the No. 2 maker of standalone DRAM memory chips, Hynix Semiconductor, based in Inchon, South Korea. The technology, called Z-RAM could double the density of Hynix's memory chips.
IEEE Spectrum September 2010 Schow et al.	Get on the Optical Bus IBM's light-powered links overcome the greatest speed bump in supercomputing: interconnect bandwidth
PC World September 12, 2002 James Niccolai	Tomorrow's CPU: Wireless Link Inside Intel finds new ways to shrink, speed chips, plus build in radio functions.
InternetNews May 3, 2007 Andy Patrizio	IBM Introduces The Self-Assembling Chip IBM's chip researchers have been busy developing a special polymer that can self-assemble, putting an insulator around wires at the nano-scale level and allowing the trend for smaller/faster/cooler chips to continue.
The Motley Fool March 15, 2006 Dan Bloom	Probing Into FormFactor FormFactor's advanced probe cards help semiconductor manufacturers cut costs. The stock market has certainly noticed FormFactor's performance and potential.
Military & Aerospace Electronics March 2005 Tom Adams	The shrinking-package approach to low-cost, robust sensor arrays One potential benefit of shrinking the sizes of microelectronics components is the potential to scatter a large number of sensors arranged as a distributed array over an area for surveillance.
PC Magazine August 30, 2006 John C. Dvorak	Inside Track v25n16 There needs to be something besides high-end games that can suck up all the power of Intel's dual-core chips. This desperation will only get worse when Intel rolls out the four-core chip.
IEEE Spectrum May 2009 Brian R. Santo	25 Microchips That Shook the World A list of some of the most innovative, intriguing, and inspiring integrated circuits