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Military & Aerospace Electronics
April 2006
Gurnett & Adams |
A Military and Aerospace Future for Board-Embedded Chips? There are as yet no distinctly military or aerospace applications for embedded chips, but the advantages that these structures provide are so compelling that their use in military applications seems inevitable within a few years.   |
Military & Aerospace Electronics
July 2008
Gurnett & Adams |
Farewell to Surface Mount? The idea of placing components inside the printed circuit board (PCB), rather then on the surface, has come and gone several times. Today, however, the concept is re-appearing with more promise and credibility than it has before. |
IEEE Spectrum
June 2006
Rao R. Tummala |
Moore's Law Meets Its Match By 2010, the "More Than Moore's Law" movement -- which focuses on system integration rather than transistor density -- will lead to revolutionary megafunction electronics. |
Military & Aerospace Electronics
March 2005
Tom Adams |
The shrinking-package approach to low-cost, robust sensor arrays One potential benefit of shrinking the sizes of microelectronics components is the potential to scatter a large number of sensors arranged as a distributed array over an area for surveillance. |
Military & Aerospace Electronics
October 2004 |
The move to lead-free solders has its own challenges and hidden problems Peak reflow temperature increases and the imperfectly known characteristics of new materials lie at the core of the problem. Will the new finish layer on the lead frame adhere well to the epoxy? Will the epoxy stick to the die face? |
IEEE Spectrum
April 2010
James Turner |
Build a Custom-Printed Circuit Board PCBs aren't so hard to make and needn't break the bank |
Military & Aerospace Electronics
June 2006
Gurnett & Adams |
Copper-post technology shows promise for cooling in military applications The change from solder bumps to copper posts has far-reaching implications for advanced electronics in military and aerospace applications. |
Military & Aerospace Electronics
July 2005
Gurnett & Adams |
Lead-free processing involves several board issues As worldwide electronics manufacturing moves slowly and unevenly into lead-free materials and processes, board assemblers should pay attention to six areas of potential problems. |
Technology Research News
July 16, 2003 |
Jet-laser tandem prints gold Researchers have found a way to print gold structures. The researchers suspended gold nanoparticles, which have a lower melting point then bulk gold, in a solution and used a modified ink-jet printer to print patterns of the solution onto a surface. |
